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cond-mat.mtrl-sci2026
High Thermal Conductivity of Back-End-of-Line Compatible Diamond Films
Jinwen Liu, Chufei Cheng, Feifei Tan +6
Back-end-of-line (BEOL) thermal management requires electrically insulating heat-spreading dielectric that can be integrated within thermal budgets below 400 C. Here, we report pol…
cond-mat.mtrl-sci2026
High Thermal Conductivity in Back-End-of-Line Compatible AlN Thin Films
Xufei Guo, Zirou Chen, Zifeng Huang +3
With thermal issues becoming a major challenge to the development of integrated circuits (ICs), high-thermal-conductivity (high-TC) materials are gaining interest from both the ind…