activity
19942026
most citedCombined measurements of Higgs boson production and decay using up to fb of proton-proton collision data at 13 TeV collected with the ATLAS experiment

489 citations · 8.4k across the 157 of their papers we have counts for

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physics.ins-det2023★ 16 cited

MALTA-Cz: A radiation hard full-size monolithic CMOS sensor with small electrodes on high-resistivity Czochralski substrate

H. Pernegger, P. Allport, D. V. Berlea +36

Depleted Monolithic Active Pixel Sensor (DMAPS) sensors developed in the Tower Semiconductor 180 nm CMOS imaging process have been designed in the context of the ATLAS ITk upgrade…

physics.ins-det2022★ 9 cited

Timing performance of radiation hard MALTA monolithic Pixel sensors

G. Gustavino, P. Allport, I. Asensi +26

The MALTA family of Depleted Monolithic Active Pixel Sensor (DMAPS) produced in Tower 180 nm CMOS technology targets radiation hard applications for the HL-LHC and beyond. Several…

physics.ins-det2019★ 337 cited

ATLAS data quality operations and performance for 2015-2018 data-taking

ATLAS Collaboration

The ATLAS detector at the Large Hadron Collider reads out particle collision data from over 100 million electronic channels at a rate of approximately kHz, with a recording r…

physics.ins-det2019★ 229 cited

Electron reconstruction and identification in the ATLAS experiment using the 2015 and 2016 LHC proton-proton collision data at = 13 TeV

ATLAS Collaboration

Algorithms used for the reconstruction and identification of electrons in the central region of the ATLAS detector at the Large Hadron Collider (LHC) are presented in this paper; t…

physics.ins-det2018

MAGIS-100 at Fermilab

Jon Coleman

MAGIS-100 is a next-generation instrument that uses light-pulse atom interferometry to search for physics beyond the standard model, to be built and installed at Fermilab. We propo…

physics.ins-det2016

X-ray Metrology of an Array of Active Edge Pixel Sensors for Use at Synchrotron Light Sources

R. Plackett, K. Arndt, D. Bortoletto +5

We report on the production of an array of active edge silicon sensors as a prototype of a large array. Four Medipix3RX.1 chips were bump bonded to four single chip sized Advacam a…