2 papers
math.NA2026
WarpagePINN: Thermal Warpage Prediction in Advanced Packaging via a Two-Stage Physics-Informed Neural Networks
Xinyu Li, Min Tang, Zeyu Sun +3
Thermal warpage has become a critical issue in advanced packaging, primarily caused by the mismatch in coefficients of thermal expansion (CTE) among heterogeneously integrated mate…
cs.LG2026
Variational Matrix-Learning Fourier Networks for Parametric Multiphysics Surrogates
Xinyu Li, Jianhua Zhang, Liang Chen
Multiphysics simulation is critical for system-technology co-optimization (STCO) in chiplet-based design, but repeated finite-element solutions of PDE-governed problems are computa…