collaborators

1 paper

cond-mat.mes-hall2026

Strain and Twist Engineering of Interfacial Thermal Transport in Homo- and Hetero-Interfaces of Graphene and Hexagonal Boron Nitride

Wenwu Jiang, Huasong Qin, Yilun Liu +3

A dramatic difference between the vertical thermal conductance response of homogeneous and heterogeneous graphene/h-BN interfaces to external mechanical perturbations, is predicted…