2 papers
physics.comp-ph2026
Wafer-to-Wafer Bonding: Part: I -- The Coupled Physics Problem and the 2D Finite Element Implementation
Kamalendu Ghosh, Bhavesh Shrimali, Subin Jeong
Wafer-to-wafer (WxW) bonding is a key enabler for three-dimensional integration, including hybrid bonding for fine-pitch Cu--Cu interconnects. During bonding, wafer deformation and…
physics.comp-ph2024
Hybrid finite element implementation of two-potential constitutive modeling of dielectric elastomers
Kamalendu Ghosh, Bhavesh Shrimali
Dielectric elastomers are increasingly studied for their potential in soft robotics, actuators, and haptic devices. Under time-dependent loading, they dissipate energy via viscous…