5 papers
FAPlace: Joint Optimization of Chiplet Placement and Interposer Footprint for 2.5D Systems
Yubo Hou, Sezin Kircali Ata, Gen Liang Lim +4
The placement of chiplets on a silicon interposer is a pivotal step in 2.5D system integration, yet existing placement approaches typically assume a pre-defined interposer footprin…
Inverse prediction of capacitor multiphysics dynamic parameters using deep generative model
Kart-Leong Lim, Rahul Dutta, Mihai Rotaru
Finite element simulations are run by package design engineers to model design structures. The process is irreversible meaning every minute structural adjustment requires a fresh i…
Physics Informed Neural Network using Finite Difference Method
Kart Leong Lim, Rahul Dutta, Mihai Rotaru
In recent engineering applications using deep learning, physics-informed neural network (PINN) is a new development as it can exploit the underlying physics of engineering systems.…
TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
Yubo Hou, Furen Zhuang, Partha Pratim Kundu +5
The rapid growth of electronics has accelerated the adoption of 2.5D integrated circuits, where effective automated chiplet placement is essential as systems scale to larger and mo…
Boundary-Decoder network for inverse prediction of capacitor electrostatic analysis
Kart-Leong Lim, Rahul Dutta, Mihai Rotaru
Traditional electrostatic simulation are meshed-based methods which convert partial differential equations into an algebraic system of equations and their solutions are approximate…