29 citations · 48 across the 4 of their papers we have counts for
4 papers · 1 filter
Graded Index Couplers for Next Generation Chip-to-Chip and Fiber-to-Chip Photonic Packaging
Drew Weninger, Christian Duessel, Samuel Serna +2
The transition towards designs which co-package electronic and photonic die together in data center switch packages has created a scaling path to Petabyte per second (Pbps) input/o…
Crown ether decorated silicon photonics for safeguarding against lead poisoning
Luigi Ranno, Yong Zen Tan, Chi Siang Ong +12
Lead (Pb2+) toxification in society is one of the most concerning public health crisis that remains unaddressed. The exposure to Pb2+ poisoning leads to a multitude of enduring hea…
High Density Vertical Optical Interconnects for Passive Assembly
Drew Weninger, Samuel Serna, Achint Jain +2
The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design, the scaling of bandwi…
Free-form micro-optics enabling ultra-broadband low-loss fiber-to-chip coupling
Shaoliang Yu, Luigi Ranno, Qingyang Du +5
Efficient fiber-to-chip coupling has been a major hurdle to cost-effective packaging and scalable interconnections of photonic integrated circuits. Conventional photonic packaging…