17 citations · 19 across the 3 of their papers we have counts for
3 papers
Graded Index Couplers for Next Generation Chip-to-Chip and Fiber-to-Chip Photonic Packaging
Drew Weninger, Christian Duessel, Samuel Serna +2
The transition towards designs which co-package electronic and photonic die together in data center switch packages has created a scaling path to Petabyte per second (Pbps) input/o…
Highly-efficient fiber to Si-waveguide free-form coupler for foundry-scale silicon photonics
Luigi Ranno, Jia Xu Brian Sia, Cosmin Popescu +7
As silicon photonics transitions from research to commercial deployment, packaging solutions that efficiently couple light into highly-compact and functional sub-micron silicon wav…
High Density Vertical Optical Interconnects for Passive Assembly
Drew Weninger, Samuel Serna, Achint Jain +2
The co-packaging of optics and electronics provides a potential path forward to achieving beyond 50 Tbps top of rack switch packages. In a co-packaged design, the scaling of bandwi…