most citedDefect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging

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eess.SY2025★ 1 cited

Defect Analysis and Built-In-Self-Test for Chiplet Interconnects in Fan-out Wafer-Level Packaging

Partho Bhoumik, Christopher Bailey, Krishnendu Chakrabarty

Fan-out wafer-level packaging (FOWLP) addresses the demand for higher interconnect densities by offering reduced form factor, improved signal integrity, and enhanced performance. H…