2 papers
eess.SY2026
Generative Design of Liquid-Cooling Channels for Thermal Management of 2.5D and 3D Integrated Advanced Packaging
Michael Acquah, Zheng Liu
High power multi-chip packages require increasingly effective cooling as more heat is generated within a limited package area. This work presents a physics-guided generative design…
eess.SY2026
Cooling Channel Design Optimization for High Power Multi-Chip Packages
Michael Acquah, Zheng Liu
Thermal management is a major challenge in next-generation high-performance computing systems, particularly for heterogeneous multi-chip packages such as the NVIDIA GB200 Grace Bla…