1 citations · 2 across the 3 of their papers we have counts for
3 papers
cs.AR2025
Cool-3D: An End-to-End Thermal-Aware Framework for Early-Phase Design Space Exploration of Microfluidic-Cooled 3DICs
Runxi Wang, Ziheng Wang, Ting Lin +3
The rapid advancement of three-dimensional integrated circuits (3DICs) has heightened the need for early-phase design space exploration (DSE) to minimize design iterations and unex…
cond-mat.mes-hall2024★ 1 cited
Strained topological insulator spin-orbit torque random access memory (STI-SOTRAM) bit cell for energy-efficient Processing in Memory
Md Golam Morshed, Hamed Vakili, Mohammad Nazmus Sakib +3
We present a novel design of a strained topological insulator spin-orbit torque random access memory (STI-SOTRAM) bit cell comprising a piezoelectric/magnet (gating)/topological in…
cs.AR2024★ 1 cited
Hot-LEGO: Architect Microfluidic Cooling Equipped 3DICs with Pre-RTL Thermal Simulation
Runxi Wang, Jun-Han Han, Mircea Stan +1
Microfluidic cooling has been recognized as one of the most promising solutions to achieve efficient thermal management for three-dimensional integrated circuits (3DICs). It enable…