2 papers
physics.app-ph2026
Low Distortion Fusion Bonding using Pneumatically Warped Wafers
Utkarsh Jain, Koen D'have, Philipp Schmidt +8
Backside power-delivery-network (BSPDN) schemes require wafer-to-wafer bonding steps that do not leave high order shape changes or localized stresses in the bonded stack to ensure…
cond-mat.mes-hall2026
Graphene-based Photodetector with Engineered Hot Carrier Cooling Dynamics
Yishu Huang, Anand Nivedan, Florian Ludwig +9
Graphene has emerged as a promising material for integration into silicon photonics, owing to its ultrafast and broadband photoresponse without the need for an external bias voltag…