activity
20232026
most citedAnalytical Die-to-Die 3D Placement with Bistratal Wirelength Model and GPU Acceleration

2 citations · 2 across the 5 of their papers we have counts for

collaborators
Showing cs.ARShow all

2 papers · 1 filter

cs.AR2024

Analytical Heterogeneous Die-to-Die 3D Placement with Macros

Yuxuan Zhao, Peiyu Liao, Siting Liu +3

This paper presents an innovative approach to 3D mixed-size placement in heterogeneous face-to-face (F2F) bonded 3D ICs. We propose an analytical framework that utilizes a dedicate…

cs.AR2023★ 2 cited

Analytical Die-to-Die 3D Placement with Bistratal Wirelength Model and GPU Acceleration

Peiyu Liao, Yuxuan Zhao, Dawei Guo +2

In this paper, we present a new analytical 3D placement framework with a bistratal wirelength model for F2F-bonded 3D ICs with heterogeneous technology nodes based on the electrost…