3 papers
quant-ph2026
Void-Free Through-Glass Vias for Multilayer Surface-Electrode Ion Traps
Eike Iseke, Jacob Stupp, Friederike Giebel +6
Through-substrate interconnects are a key technology for scaling surface-electrode ion traps (SEITs) toward large electrode counts and complex architectures. Dielectric substrates…
cs.CV2025
InstanceBEV: Unifying Instance and BEV Representation for 3D Panoptic Segmentation
Feng Li, Zhaoyue Wang, Enyuan Zhang +3
BEV-based 3D perception has emerged as a focal point of research in end-to-end autonomous driving. However, existing BEV approaches encounter significant challenges due to the larg…
cs.NI2023
Performance Comparison Between VoLTE and non-VoLTE Voice Calls During Mobility in Commercial Deployment: A Drive Test-Based Analysis
Rashed Hasan Ratul, Muhammad Iqbal, Jen-Yi Pan +3
The optimization of network performance is vital for the delivery of services using standard cellular technologies for mobile communications. Call setup delay and User Equipment (U…