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physics.app-ph2024
The Impact of TaS-Augmented Interconnects on Circuit Performance: A Temperature-Dependent Analysis
Xinkang Chen, Sumeet Kumar Gupta
Monolayer TaS is being explored as a future liner/barrier to circumvent the scalability issues of the state-of-the-art interconnects. However, its large vertical resistivity…
physics.app-ph2024★ 2 cited
Spatially Resolved Conductivity of Rectangular Interconnects considering Surface Scattering -- Part II: Circuit-Compatible Modeling
Xinkang Chen, Sumeet Kumar Gupta
Interconnect conductivity modeling is a critical aspect for modern chip design. Surface scattering -- an important scattering mechanism in scaled interconnects is usually captured…
physics.app-ph2024★ 4 cited
Spatially Resolved Conductivity of Rectangular Interconnects considering Surface Scattering -- Part I: Physical Modeling
Xinkang Chen, Sumeet Kumar Gupta
Accurate modeling of interconnect conductivity is important for performance evaluation of chips in advanced technologies. Surface scattering in interconnects is usually treated by…