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cs.AR2026
Multi-Partner Project: COIN-3D -- Collaborative Innovation in 3D VLSI Reliability
George Rafael Gourdoumanis, Fotoini Oikonomou, Maria Pantazi-Kypraiou +10
As semiconductor manufacturing advances from the 3-nm process toward the sub-nanometer regime and transitions from FinFETs to gate-all-around field-effect transistors (GAAFETs), th…
cs.AR2025
Energy-Efficient QoS-Aware Scheduling for S-NUCA Many-Cores
Sudam M. Wasala, Jurre Wolff, Yixian Shen +3
Optimizing performance and energy efficiency in many-core processors, especially within Non-Uniform Cache Access (NUCA) architectures, remains a critical challenge. The performance…