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cs.AR2025
Physical Design Exploration of a Wire-Friendly Domain-Specific Processor for Angstrom-Era Nodes
Lorenzo Ruotolo, Lara Orlandic, Pengbo Yu +8
This paper presents the physical design exploration of a domain-specific processor (DSIP) architecture targeted at machine learning (ML), addressing the challenges of interconnect…
cs.ET2025
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
Yukai Chen, Massimiliano Di Todaro, Bjorn Vermeersch +5
Advances in nanosheet technologies have significantly increased power densities, exacerbating thermal management challenges in 2.5D/3D chiplet-based Systems-in-Package (SiP). While…