Showing cs.ETShow all
2 papers · 1 filter
cs.ET2026
Beyond HBM-on-GPU: Thermal Design Envelope for 3D Volumetric DRAM-on-GPU Integration
Yukai Chen, Melina Lofrano, Khakim Akhunov +12
The scaling of GPUs for AI and HPC workloads is increasingly constrained by the capacity, bandwidth, and thermal limits of both 2.5D HBM-GPU and direct-stacked 3D HBM-on-GPU integr…
cs.ET2025
Thermal Implications of Non-Uniform Power in BSPDN-Enabled 2.5D/3D Chiplet-based Systems-in-Package using Nanosheet Technology
Yukai Chen, Massimiliano Di Todaro, Bjorn Vermeersch +5
Advances in nanosheet technologies have significantly increased power densities, exacerbating thermal management challenges in 2.5D/3D chiplet-based Systems-in-Package (SiP). While…