1 citations · 2 across the 6 of their papers we have counts for
6 papers
Depth-Resolved Thermal Conductivity of HFCVD Diamond Films via Square-Pulsed Thermometry
Kexin Zhang, Xiaosong Han, Ershuai Yin +3
The integration of high-thermal-conductivity diamond films onto silicon carbide (SiC) substrates offers a promising pathway for thermal management in high-power electronic devices.…
Thermal Transport of GaN/Substrate Heterostructures under Non-Uniform Heat Source
Ershuai Yin, Wenzhu Luo, Lei Wang +2
Heat generated in gallium nitride (GaN) high-electron-mobility transistors (HEMTs) is often concentrated in nanoscale regions and must dissipate through multiple heterostructures.…
Effects of Defects on Thermal Transport across Solid/Solid Heterogeneous Interfaces
Ershuai Yin, Wenzhu Luo, Lei Wang +1
During the fabrication of heterogeneous structures inside chips, impurities and defects are inevitably introduced. However, the mechanism by which defects affect interfacial heat t…
Enhancing interfacial thermal conductance in Si/Diamond heterostructures by phonon bridge
Ershuai Yin, Qiang Li, Wenzhu Luo +1
This study investigates the mechanism of enhancing interfacial thermal transport performance in Silicon/Diamond (Si/Diamond) heterostructures using the phonon bridge. A heat transf…
Heat transfer enhancement of N-Ga-Al semiconductors heterogeneous interfaces
Wenzhu Luo, Ershuai Yin, Lei Wang +3
Heat transfer enhancement of N-Ga-Al semiconductor heterostructure interfaces is critical for the heat dissipation in GaN-based electronic devices, while the effect of the AlxGa(1-…
Enhancing interfacial thermal transport by nanostructures: Monte Carlo simulations with ab initio phonon properties
Wenzhu Luo, Neng Wang, Wenlei Lian +2
Recent experiments have indicated that employing nanostructures can enhance interfacial heat transport, but the mechanism by which different structural morphologies and dimensions…