3D Electronic-Photonic Heterogenous Interconnect Platforms Enabling Energy-Efficient Scalable Architectures For Future HPC Systems

Anirban Samanta, Shun-Hung Lee, Chun-Yi Cheng +2

3D interconnects have emerged as a solution to address the scaling issues of interconnect bandwidth and the memory wall problem in high-performance computing (HPC), such as High-Ba…