activity
20232026
collaborators

6 papers

cs.CE2026

IC-ThermBench: An Open, Progressive Benchmark for Generalizable 2.5D/3D-IC Thermal Learning

David Hang, Wenkai Yang, Kuiye Ding +2

Standardized benchmarks are fundamental to reliable progress in AI for EDA, including learning-based thermal modeling. However, existing thermal prediction studies often rely on di…

cs.CE2026

Therm-FM: Foundation Model is ALL YOU NEED for 3D-ICs Thermal Simulation

Zhen Huang, Haiyang Xin, Wenkai Yang +6

Data-driven thermal predictors for 3D-ICs are often trained from scratch for each chip design using many high-fidelity finite-element simulations, leading to high data-generation c…

cs.AI2025

Accelerating IC Thermal Simulation Data Generation via Block Krylov and Operator Action

Hong Wang, Wenkai Yang, Jie Wang +6

Recent advances in data-driven approaches, such as neural operators (NOs), have shown substantial efficacy in reducing the solution time for integrated circuit (IC) thermal simulat…

cs.LG2025

Self-Attention to Operator Learning-based 3D-IC Thermal Simulation

Zhen Huang, Hong Wang, Wenkai Yang +6

Thermal management in 3D ICs is increasingly challenging due to higher power densities. Traditional PDE-solving-based methods, while accurate, are too slow for iterative design. Ma…

cs.CV2025

H3DE-Net: Efficient and Accurate 3D Landmark Detection in Medical Imaging

Zhen Huang, Tao Tang, Ronghao Xu +6

3D landmark detection is a critical task in medical image analysis, and accurately detecting anatomical landmarks is essential for subsequent medical imaging tasks. However, mainst…

cs.CV2023

Two Stream Scene Understanding on Graph Embedding

Wenkai Yang, Wenyuan Sun, Runxaing Huang

The paper presents a novel two-stream network architecture for enhancing scene understanding in computer vision. This architecture utilizes a graph feature stream and an image feat…