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20232026
most citedMFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

2 citations · 3 across the 10 of their papers we have counts for

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9 papers · 1 filter

cs.AR2026

HYDRA: A Heterogeneous Chiplet DSE Framework for Serving Dynamic Hybrid LLM Workloads

Jiahao Lin, Alish Kanani, Sangwan Lee +2

Hybrid Transformer-Mamba large language models (LLMs) enhance long-context efficiency, but their heterogeneous computation and communication patterns complicate efficient hardware…

cs.AR2026

APEX: Adaptive Expert Prefetching for Memory-Efficient Edge MoE Inference

Alish Kanani, Layan Badawi, Umit Y. Ogras

Mixture-of-Experts (MoE) models are attractive for edge deployment because they provide high model capacity while activating only a small subset of parameters per token, improving…

cs.AR2026

ReVolt: Power Delivery Network-Aware Voltage Droop Control for 2.5D PIM Chiplet Architectures

Vibhanshu Sharma, Alish Kanani, Miao Sun +3

Processing-in-memory (PIM)-based 2.5D multi-chiplet platforms are enablers for machine learning (ML) workloads. However, their performance is affected by the power delivery network…

cs.AR2026

LEXI: Lossless Exponent Coding for Efficient Inter-Chiplet Communication in Hybrid LLMs

Miao Sun, Alish Kanani, Kaushik Shroff +1

Data movement overheads increase the inference latency of state-of-the-art large language models (LLMs). These models commonly use the bfloat16 (BF16) format for stable training. F…

cs.AR2026

DUET: Disaggregated Hybrid Mamba-Transformer LLMs with Prefill and Decode-Specific Packages

Alish Kanani, Sangwan Lee, Han Lyu +3

Large language models operate in distinct compute-bound prefill followed by memory bandwidth-bound decode phases. Hybrid Mamba-Transformer models inherit this asymmetry while addin…

cs.AR2025★ 1 cited

CHIPSIM: A Co-Simulation Framework for Deep Learning on Chiplet-Based Systems

Lukas Pfromm, Alish Kanani, Harsh Sharma +3

Due to reduced manufacturing yields, traditional monolithic chips cannot keep up with the compute, memory, and communication demands of data-intensive applications, such as rapidly…

cs.AR2025

THERMOS: Thermally-Aware Multi-Objective Scheduling of AI Workloads on Heterogeneous Multi-Chiplet PIM Architectures

Alish Kanani, Lukas Pfromm, Harsh Sharma +3

Chiplet-based integration enables large-scale systems that combine diverse technologies, enabling higher yield, lower costs, and scalability, making them well-suited to AI workload…

cs.AR2024★ 2 cited

MFIT: Multi-Fidelity Thermal Modeling for 2.5D and 3D Multi-Chiplet Architectures

Lukas Pfromm, Alish Kanani, Harsh Sharma +6

Rapidly evolving artificial intelligence and machine learning applications require ever-increasing computational capabilities, while monolithic 2D design technologies approach thei…

cs.AR2023

Ellora: Exploring Low-Power OFDM-based Radar Processors using Approximate Computing

Rajat Bhattacharjya, Alish Kanani, A Anil Kumar +3

In recent times, orthogonal frequency-division multiplexing (OFDM)-based radar has gained wide acceptance given its applicability in joint radar-communication systems. However, rea…