4 papers
Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements
Zifeng Huang, Yiyang Sun, Tianyu Jia +2
The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (\k{appa}) modeling framework. Howev…
ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC
Qipan Wang, Tianxiang Zhu, Tianyu Jia +3
Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integra…
EdgeMM: Multi-Core CPU with Heterogeneous AI-Extension and Activation-aware Weight Pruning for Multimodal LLMs at Edge
Kangbo Bai, Le Ye, Ru Huang +1
Emerging multimodal LLMs (MLLMs) exhibit strong cross-modality perception and reasoning capabilities and hold great potential for various applications at edge. However, MLLMs typic…
Leveraging Compute-in-Memory for Efficient Generative Model Inference in TPUs
Zhantong Zhu, Hongou Li, Wenjie Ren +4
With the rapid advent of generative models, efficiently deploying these models on specialized hardware has become critical. Tensor Processing Units (TPUs) are designed to accelerat…