4 papers
Toward Multi-kW Power Delivery Methodologies for Advanced 3D Heterogeneous Integration
Peiyi Yue, Hangyu Zhang, Ratul Das +2
The demands of modern applications require the construction of ever more complex integrated systems, with AI applications in particular serving as a significant driver for increase…
Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
Emad Haque, Pragnya Sudershan Nalla, Jeff Zhang +3
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-s…
Accelerating Electrostatics-based Global Placement with Enhanced FFT Computation
Hangyu Zhang, Sachin S. Sapatnekar
Global placement is essential for high-quality and efficient circuit placement for complex modern VLSI designs. Recent advancements, such as electrostatics-based analytic placement…
ML-based AIG Timing Prediction to Enhance Logic Optimization
Wenjing Jiang, Jin Yan, Sachin S. Sapatnekar
As circuit designs become more intricate, obtaining accurate performance estimation in early stages, for effective design space exploration, becomes more time-consuming. Traditiona…