1 citations · 1 across the 3 of their papers we have counts for
3 papers
Tiny Chiplets Enabled by Packaging Scaling: Opportunities in ESD Protection and Signal Integrity
Emad Haque, Pragnya Sudershan Nalla, Jeff Zhang +3
The scaling of advanced packaging technologies provides abundant interconnection resources for 2.5D/3D heterogeneous integration (HI), thereby enabling the construction of larger-s…
Cross-Stage Sensorimotor Perception Scheduling and Sparse Map Encoding for Efficient Edge Embodied Navigation
Yaotian Liu, Sri Sai Rakesh Nakkilla, Xiangyu Zhou +2
Embodied agents must close a perception-to-action loop on embedded hardware under tight latency, memory, and energy budgets, making deployment a system-level co-design problem rath…
Advanced Large Language Model (LLM)-Driven Verilog Development: Enhancing Power, Performance, and Area Optimization in Code Synthesis
Kiran Thorat, Jiahui Zhao, Yaotian Liu +5
The increasing use of Advanced Language Models (ALMs) in diverse sectors, particularly due to their impressive capability to generate top-tier content following linguistic instruct…