2 papers
cs.LG2026
TDPNavigator-Placer: Thermal- and Wirelength-Aware Chiplet Placement in 2.5D Systems Through Multi-Agent Reinforcement Learning
Yubo Hou, Furen Zhuang, Partha Pratim Kundu +5
The rapid growth of electronics has accelerated the adoption of 2.5D integrated circuits, where effective automated chiplet placement is essential as systems scale to larger and mo…
cond-mat.mtrl-sci2025
Strengthening and toughening mechanisms in heterostructured laminates revealed by a phase field-enhanced crystal plasticity simulation
Yukai Xiong, Jianfeng Zhao, Jinling Liu +3
Heterostructured (HS) materials exhibit excellent mechanical properties, combining high strength and significant ductility. Hetero-deformation-induced (HDI) hardening and strain de…