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cond-mat.supr-con2026
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
Harsh Mishra, Ullas Pandey, Sathish Bonam +3
Wafer-level 3D integration of superconducting interconnects requires low-thermal budget bonding processes compatible with superconducting materials. Rapid native oxide formation on…
cond-mat.supr-con2025
Demonstration of surface-engineered oxidation-resistant Nb-Nb thermocompression bonding toward scalable superconducting quantum computing architectures
Harsh Mishra, Yusuke Kozuka, Sathish Bonam +4
Scalable quantum computing currently requires a large array of qubit integration, but present two-dimensional interconnects face challenges such as wiring congestion, electromagnet…