4 papers
Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
Mohammad Elahi, Max O. Bloomfield, Theodorian Borca-Tasciuc +1
Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting for the heterogeneity in back end of the line…
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, Zongmin Yang +6
Thermally aware design of 2.5D and 3D advanced packaging systems will require fast, accurate, and powerful thermal analysis of chiplets, stacks, and packages. These systems contain…
Morphology-engineered nanostructured silver- and antimony-telluride films for flexible thermoelectric generators
Ankit Kashyap, Conner Wallace, Geetu Sharma +7
Harvesting low-grade heat to electricity is attractive for powering wearable electronic devices. Here, we demonstrate nW-scale thermoelectric power generation in devices from thin…
Development and Assessment of a Miniaturized Thermocouple for Precise Temperature Measurement in Biological Tissues and Cells
Onnop Srivannavit, Rakesh Joshi, Weibin Zhu +4
This study presents a novel thermocouple instrument designed for precise temperature monitoring within biological tissues and cells, addressing a significant gap in biological rese…