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cs.AR2026
Fovea: Physical-Implication-Aware Wafer-Scale DSE with Decision-Domain-Guided Cross-Fidelity Refinement
Jinxi Li, Huizheng Wang, Jinyi Deng +2
Modern pre-silicon design-space exploration (DSE) follows a coarse-to-fine workflow: low-cost evaluators screen candidate spaces, while detailed evaluation is reserved for a shortl…
cs.AR2026
MOCAP: Wafer-Scale-Chip-Oriented Memory-Orchestrated Chunked Pipelining Framework for Prefill-Only LLM Inference
Zichuan Wang, Huizheng Wang, Yuheng Xiao +6
Large language models (LLMs) are increasingly used in prefill-only workloads, where end-to-end latency is dominated by the prefill phase. For long-context prefill, communication ov…
cs.AR2025
TEMP: A Memory Efficient Physical-aware Tensor Partition-Mapping Framework on Wafer-scale Chips
Huizheng Wang, Taiquan Wei, Zichuan Wang +8
Large language models (LLMs) demand significant memory and computation resources. Wafer-scale chips (WSCs) provide high computation power and die-to-die (D2D) bandwidth but face a…