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cs.AR2025
TEMP: A Memory Efficient Physical-aware Tensor Partition-Mapping Framework on Wafer-scale Chips
Huizheng Wang, Taiquan Wei, Zichuan Wang +8
Large language models (LLMs) demand significant memory and computation resources. Wafer-scale chips (WSCs) provide high computation power and die-to-die (D2D) bandwidth but face a…
cs.AR2023★ 1 cited
Wafer-scale Computing: Advancements, Challenges, and Future Perspectives
Yang Hu, Xinhan Lin, Huizheng Wang +12
Nowadays, artificial intelligence (AI) technology with large models plays an increasingly important role in both academia and industry. It also brings a rapidly increasing demand f…