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math.NA2025★ 5 cited
A coupled finite element-virtual element method for thermomechanical analysis of electronic packaging structures
Yanpeng Gong, Sishuai Li, Yue Mei +4
This study presents a finite element and virtual element (FE-VE) coupled method for thermomechanical analysis in electronic packaging structures. The approach partitions computatio…
math.NA2025★ 3 cited
Physics-Informed Kolmogorov-Arnold Networks for multi-material elasticity problems in electronic packaging
Yanpeng Gong, Yida He, Yue Mei +3
This paper proposes a Physics-Informed Kolmogorov-Arnold Network for analyzing elasticity problems in multi-material electronic packaging structures. The method replaces traditiona…