Differentiable Partitioning With Dual-Max 3D Wirelength Model and Hybrid Bonding Terminal Awareness for Optimized 3D Placement

Liwen Jiang, Xu Shi, Rufeng Xiao +4

Research on 3D integrated circuits (3D-ICs) physical design has expanded rapidly in recent years, driven by the increasing adoption of hybrid bonding and the demand for higher inte…