activity
20222026
collaborators

7 papers

physics.ins-det2026

Characterization of Silicon-Membrane TES Microcalorimeters for Large-Format X-ray Spectrometers with Integrated Microwave SQUID Readout

Avirup Roy, Robinjeet Singh, Joel C. Weber +17

We present the electro-thermal characterization of transition-edge sensor (TES) detectors suspended on Si membranes fabricated using a silicon-on-insulator (SOI) wafer. The use of…

physics.ins-det2025

Lithographic integration of TES microcalorimeters with SQUID multiplexer circuits for large format spectrometers

Robinjeet Singh, Avirup Roy, Daniel Becker +12

Arrays of hundreds or thousands of low temperature detectors have been deployed for many experiments, both bolometers for long wavelength applications and calorimeters for shorter…

cond-mat.mes-hall2023

Semiconductor thermal and electrical properties decoupled by localized phonon resonances

Bryan T. Spann, Joel C. Weber, Matt D. Brubaker +8

Thermoelectric materials convert heat into electricity through thermally driven charge transport in solids, or vice versa for cooling. To be competitive with conventional energy-ge…

astro-ph.IM2023

ASCENT - A balloon-borne hard X-ray imaging spectroscopy telescope using transition edge sensor microcalorimeter detectors

Fabian Kislat, Daniel Becker, Douglas Bennett +26

Core collapse supernovae are thought to be one of the main sources in the galaxy of elements heavier than iron. Understanding the origin of the elements is thus tightly linked to o…

physics.ins-det2022

A tabletop x-ray tomography instrument for nanometer-scale imaging: demonstration of the 1,000-element transition-edge sensor subarray

Paul Szypryt, Nathan Nakamura, Daniel T. Becker +28

We report on the 1,000-element transition-edge sensor (TES) x-ray spectrometer implementation of the TOMographic Circuit Analysis Tool (TOMCAT). TOMCAT combines a high spatial reso…

physics.ins-det2022

Design of a 3000-pixel transition-edge sensor x-ray spectrometer for microcircuit tomography

Paul Szypryt, Douglas A. Bennett, William J. Boone +28

Feature sizes in integrated circuits have decreased substantially over time, and it has become increasingly difficult to three-dimensionally image these complex circuits after fabr…