6 citations · 6 across the 5 of their papers we have counts for
5 papers
ATSim3D: Towards Accurate Thermal Simulator for Heterogeneous 3D-IC Systems Considering Nonlinear Leakage and Conductivity
Qipan Wang, Tianxiang Zhu, Yibo Lin +2
Thermal simulation plays a fundamental role in the thermal design of integrated circuits, especially 3D ICs. Current simulators require significant runtime for high-resolution simu…
SpecASR: Accelerating LLM-based Automatic Speech Recognition via Speculative Decoding
Linye Wei, Shuzhang Zhong, Songqiang Xu +3
Large language model (LLM)-based automatic speech recognition (ASR) has recently attracted a lot of attention due to its high recognition accuracy and enhanced multi-dialect suppor…
HybriMoE: Hybrid CPU-GPU Scheduling and Cache Management for Efficient MoE Inference
Shuzhang Zhong, Yanfan Sun, Ling Liang +3
The Mixture of Experts (MoE) architecture has demonstrated significant advantages as it enables to increase the model capacity without a proportional increase in computation. Howev…
ReaLM: Reliable and Efficient Large Language Model Inference with Statistical Algorithm-Based Fault Tolerance
Tong Xie, Jiawang Zhao, Zishen Wan +5
The demand for efficient large language model (LLM) inference has propelled the development of dedicated accelerators. As accelerators are vulnerable to hardware faults due to agin…
MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC
Tianxiang Zhu, Qipan Wang, Yibo Lin +2
Thermomechanical stress induced by through-silicon vias (TSVs) plays an important role in the performance and reliability analysis of 2.5D/3D ICs. While the finite element method (…