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eess.SY2025
LaMoSys3.5D: Enabling 3.5D-IC-Based Large Language Model Inference Serving Systems via Hardware/Software Co-Design
Qipan Wang, Zhe Zhang, Shuangchen Li +5
The success of large language models LLMs amplifies the need for highthroughput energyefficient inference at scale. 3DDRAMbased accelerators provide high memory bandwidth and there…
math.NA2025
ATMPlace: Analytical Thermo-Mechanical-Aware Placement Framework for 2.5D-IC
Qipan Wang, Tianxiang Zhu, Tianyu Jia +3
Rising demand in AI and automotive applications is accelerating 2.5D IC adoption, with multiple chiplets tightly placed to enable high-speed interconnects and heterogeneous integra…