4 papers
Interface-engineered oxidation-resistant wafer-level Tantalum-Tantalum thermocompression bonding for 3D integration of superconducting interconnects
Harsh Mishra, Ullas Pandey, Sathish Bonam +3
Wafer-level 3D integration of superconducting interconnects requires low-thermal budget bonding processes compatible with superconducting materials. Rapid native oxide formation on…
Efficient -qubit entangling operations via a superconducting quantum router
Xuntao Wu, Haoxiong Yan, Gustav Andersson +13
Quantum algorithms on near-term quantum processors are typically executed using shallow quantum circuits composed of one- and two-qubit gates. However, as circuit depth and gate nu…
Large Language Model-Assisted Superconducting Qubit Experiments
Shiheng Li, Jacob M. Miller, Phoebe J. Lee +14
Superconducting circuits have demonstrated significant potential in quantum information processing and quantum sensing. Implementing novel control and measurement sequences for sup…
Demonstration of surface-engineered oxidation-resistant Nb-Nb thermocompression bonding toward scalable superconducting quantum computing architectures
Harsh Mishra, Yusuke Kozuka, Sathish Bonam +4
Scalable quantum computing currently requires a large array of qubit integration, but present two-dimensional interconnects face challenges such as wiring congestion, electromagnet…