4 papers
Flip-chip integrated superconducting qubits using electroplated bump bonds
Yen-An Shih, Rebecca Gharibaan, Barka Khan +9
Flip-chip integration offers a promising route toward scalable superconducting quantum processors and hybrid semiconductor-superconductor quantum devices. We develop a three-dimens…
Coherence limitations of a Fourier-engineered transmon qubit
Nataliia K. Zhurbina, Siddharth Singh, Lukas J. Splitthoff +4
Intrinsically protected superconducting qubits are a promising route toward enhancing coherence times and advancing hardware towards applications in quantum computing. The $\cos(2Ï…
Automated, physics-guided, multi-parameter design optimization for superconducting quantum devices
Axel M. Eriksson, Lukas J. Splitthoff, Harsh Vardhan Upadhyay +5
The design of nonlinear superconducting quantum circuits often relies on time-consuming iterative electromagnetic simulations requiring manual intervention. These interventions ent…
Topological finite size effect in one-dimensional chiral symmetric systems
Guliuxin Jin, D. O. Oriekhov, Lukas Johannes Splitthoff +1
Topological phases of matter have been widely studied for their robustness against impurities and disorder. The broad applicability of topological materials relies on the reliable…