2 papers
cond-mat.str-el2026
Evaluating the Structural Basis for Polar Altermagnet Candidate Ca(Ru,Ti)O
Akash Saha, Yihuang Xiong, Vladimir A. Stoica +15
The interplay between polar and altermagnetic orders remains largely unexplored in the broader landscape of correlated electron systems. CaRuO has been proposed b…
cs.AR2025
STAMP-2.5D: Structural and Thermal Aware Methodology for Placement in 2.5D Integration
Varun Darshana Parekh, Zachary Wyatt Hazenstab, Srivatsa Rangachar Srinivasa +3
Chiplet-based architectures and advanced packaging has emerged as transformative approaches in semiconductor design. While conventional physical design for 2.5D heterogeneous syste…