2 papers
quant-ph2025
3D-Integrated Superconducting qubits: CMOS-Compatible, Wafer-Scale Processing for Flip-Chip Architectures
T. Mayer, H. Bender, S. J. K. Lang +16
In this article, we present a technology development of a superconducting qubit device 3D-integrated by flip-chip-bonding and processed following CMOS fabrication standards and con…
quant-ph2025
Wafer-Scale Characterization of Al/AlxOy/Al Josephson Junctions at Room Temperature
Simon J. K. Lang, Ignaz Eisele, Johannes Weber +13
Josephson junctions (JJs) are the key element of many devices operating at cryogenic temperatures. Development of time-efficient wafer-scale JJ characterization for process optimiz…