1 citations · 1 across the 2 of their papers we have counts for
2 papers
physics.ins-det2025
Results from a 2nd production run of low temperature wafer-wafer bonded pad-diodes for particle detection
J. Wüthrich, K. Deplazes, A. Rubbia
We are investigating the use of low temperature wafer-wafer bonding in the fabrication of next-generation particle pixel detectors. This bonding technique could enable the integrat…
physics.ins-det2022★ 1 cited
TCT investigation of the one-sided depletion of low-temperature covalently bonded silicon sensor P-N diodes
Johannes Wüthrich, Christoph Alt, André Rubbia
In the context of particle detectors, low-temperature covalent wafer-wafer bonding allows for integration of high-Z materials as absorbing layers with readout chips produced in sta…