3 papers
physics.optics2026
Plasma Etch Process Optimization for Photonic-Grade Diamond-on-Insulator Substrates and Thickness Evaluation using Colorimetry
Tianyin Chen, Alessio Miranda, Leyla Rami +2
Diamond color-center qubits integrated with photonic circuits can be initialized, manipulated, entangled, and read individually with high fidelity, making them attractive for large…
physics.app-ph2025
Strain Effects in a Directly Bonded Diamond-on-Insulator Substrate
Ioannis Varveris, Gianni D. Aliberti, Tianyin Chen +6
The direct bonding process of a diamond-on-insulator (DOI) substrate enables monolithic integration of diamond photonic structures for quantum computing by improving photon collect…
cond-mat.mtrl-sci2025
Hydrophilic direct bonding of (100) diamond and deposited SiO substrates
Tianyin Chen, Jeffrel Hermias, Salahuddin Nur +1
Diamond has emerged as a leading material for solid-state spin quantum systems and extreme environment electronics. However, a major limitation is that most diamond devices and str…