1 citations · 1 across the 10 of their papers we have counts for
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Inductive Loop Analysis for Practical HPC Application Optimization
Philipp Schaad, Tal Ben-Nun, Patrick Iff +1
Scientific computing applications heavily rely on multi-level loop nests operating on multidimensional arrays. This presents multiple optimization opportunities from exploiting par…
VEIL: Reading Control Flow Graphs Like Code
Philipp Schaad, Tal Ben-Nun, Torsten Hoefler
Control flow graphs (CFGs) are essential tools for understanding program behavior, yet the size of real-world CFGs makes them difficult to interpret. With thousands of nodes and ed…
SpaDA: A Spatial Dataflow Architecture Programming Language
Lukas Gianinazzi, Tal Ben-Nun, Torsten Hoefler
Spatial dataflow architectures like the Cerebras Wafer-Scale Engine deliver exceptional performance in AI and scientific computing by distributing scratchpad memory across hundreds…
Psychologically Enhanced AI Agents
Maciej Besta, Shriram Chandran, Robert Gerstenberger +9
We introduce MBTI-in-Thoughts, a framework for enhancing the effectiveness of Large Language Model (LLM) agents through psychologically grounded personality conditioning. Drawing o…
Benchmarking Filtered Approximate Nearest Neighbor Search Algorithms on Transformer-based Embedding Vectors
Patrick Iff, Paul Bruegger, Marcin Chrapek +3
Advances in embedding models for text, image, audio, and video drive progress across multiple domains, including retrieval-augmented generation, recommendation systems, and others.…
Higher-Order Graph Databases
Maciej Besta, Shriram Chandran, Jakub Cudak +6
Recent advances in graph databases (GDBs) have been driving interest in large-scale analytics, yet current systems fail to support higher-order (HO) interactions beyond first-order…
FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates
Patrick Iff, Maciej Besta, Torsten Hoefler
Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. T…
PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
Patrick Iff, Benigna Bruggmann, Maciej Besta +2
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low…