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cs.AR2025
FoldedHexaTorus: An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates
Patrick Iff, Maciej Besta, Torsten Hoefler
Chiplet-based systems are rapidly gaining traction in the market. Two packaging options for such systems are the established organic substrates and the emerging glass substrates. T…
cs.AR2025
PlaceIT: Placement-based Inter-Chiplet Interconnect Topologies
Patrick Iff, Benigna Bruggmann, Maciej Besta +2
2.5D integration technology is gaining traction as it copes with the exponentially growing design cost of modern integrated circuits. A crucial part of a 2.5D stacked chip is a low…