18 citations · 23 across the 2 of their papers we have counts for
2 papers
cond-mat.mtrl-sci2007★ 18 cited
Electrical, thermal and optical characterization of power LED assemblies
A. Poppe, G. Farkas, G. Horvath
Besides their electrical properties the optical parameters of LEDs also depend on junction temperature. For this reason thermal characterization and thermal management play importa…
cond-mat.mtrl-sci2007★ 5 cited
Thermal measurement and modeling of multi-die packages
A. Poppe, Y. Zhang, J. Wilson +3
Thermal measurement and modeling of multi-die packages became a hot topic recently in different fields like RAM chip packaging or LEDs / LED assemblies, resulting in vertical (stac…