Failure Analysis in Transition: An Industry Survey of Challenges, Priorities, and Standardization Needs in Advanced Packaging and Heterogeneous Integration

Himanandhan Reddy Kottur, Nusra Akter Takia, Mahamudul Hassan Fuad +3

Failure analysis is being reshaped by heterogeneous integration, chiplet-based architectures, hybrid bonding, backside technologies, & increasingly buried package structures. To ex…