EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Map Integration for VLSI Reliability

Subed Lamichhane, Haotian Lu, Sheldon X. -D. Tan

Electromigration (EM) remains a critical reliability concern in current and future copper-based VLSI circuits. As technology scales down, EM-induced IR drop becomes increasingly se…