5 papers
WarPGNN: A Parametric Thermal Warpage Analysis Framework with Physics-aware Graph Neural Network
Haotian Lu, Jincong Lu, Sachin Sachdeva +1
With the advent of system-in-package (SiP) chiplet-based design and heterogeneous 2.5D/3D integration, thermal-induced warpage has become a critical reliability concern. While conv…
EMSpice 3: Full-chip Temperature-Aware Multiphysics Electromigration and IR-Drop Analysis
Haotian Lu, Sheldon X. -D. Tan
This paper presents EMSpice~3, a full-chip multiphysics framework for coupled electromigration (EM), thermomigration (TM), and IR-drop analysis of practical power-grid (P/G) networ…
Accelerating Physics-Based Electromigration Analysis via Rational Krylov Subspaces
Sheldon X. -D. Tan, Haotian Lu
Electromigration (EM) induced stress evolution is a major reliability challenge in nanometer-scale VLSI interconnects. Accurate EM analysis requires solving stress-governing partia…
BPINN-EM-Post: Bayesian Physics-Informed Neural Network based Stochastic Electromigration Damage Analysis in the Post-void Phase
Subed Lamichhane, Haotian Lu, Sheldon X. -D. Tan
In contrast to the assumptions of most existing Electromigration (EM) analysis tools, the evolution of EM-induced stress is inherently non-deterministic, influenced by factors such…
EMSpice 2.1: A Coupled EM and IR Drop Analysis Tool with Joule Heating and Thermal Map Integration for VLSI Reliability
Subed Lamichhane, Haotian Lu, Sheldon X. -D. Tan
Electromigration (EM) remains a critical reliability concern in current and future copper-based VLSI circuits. As technology scales down, EM-induced IR drop becomes increasingly se…