collaborators

1 paper

cs.OH2007

A Generic Surface Micromachining Module for Mems Hermetic Packaging at Temperatures Below 200 degrees C

R. Hellin-Rico, J. -P. Celis, K. Baert +2

This paper presents the different processing steps of a new generic surface micromachining module for MEMS hermetic packaging at temperatures around 180 degrees C based on nickel p…