1 citations · 1 across the 2 of their papers we have counts for
2 papers
cs.OH2007★ 1 cited
Au-SN Flip-Chip Solder Bump for Microelectronic and Optoelectronic Applications
Jeong-Won Yoon, H. -S. Chun, Ja-Myeong Koo +1
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic Au-Sn alloy was used in this study. Using a co-electropla…
cs.OH2007
Effect of Surface Finish of Substrate on Mechanical Reliability of in-48SN Solder Joints in Moems Package
Ja-Myeong Koo, Seung-Boo Jung
Interfacial reactions and shear properties of the In-48Sn (in wt.%) ball grid array (BGA) solder joints after bonding were investigated with four different surface finishes of the…