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cond-mat.mtrl-sci2026
A Transport Framework for Evaluating Nanoscale Interconnect Materials
Md. Rafiqul Islam, Patrick E. Hopkins
As CMOS technology continues to scale, metallic interconnects increasingly limit circuit performance through rising resistivity, self-heating, and reliability degradation. Although…
cond-mat.mtrl-sci2025
Unveiling Phonon Contributions to Thermal Transport and the Failure of the Wiedemann-Franz Law in Ruthenium and Tungsten Thin Films
Md. Rafiqul Islam, Pravin Karna, Niraj Bhatt +12
Thermal transport in nanoscale interconnects is dominated by intricate electron-phonon interactions and microstructural influences. As copper faces limitations at the nanoscale, tu…